Camera Modules & Image Sensors
Image sensors that are integrated with control electronics that transfer optical signal into a digital signal are found in numerous applications, including handheld devices, audio, TV and gaming products, traditional DSC and SLR cameras, video camcorders, automobiles and medical systems, with handhelds driving the largest percentage of the growth. Incorporation of image sensors and all their complementary parts requires adhesive materials that cure quickly at low temperature, deliver precise position and bondline control and, in many cases, UV and transparency properties. Through the use of rheology control and filler technology, Henkel has designed unique adhesives to address emerging requirements of image sensor assembly.
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Cartão Inteligente
Os adesivos de última geração da Henkel cobrem uma infinidade de aplicações da indústria de Cartões Inteligentes e dão uma contribuição para esse negócio, em rápida expansão e com olhos para o futuro.
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DRAM
The quality of a memory module is directly related to its DRAM (Dynamic Random Access Memory) chips. Henkel recognizes the importance of this essential memory system in computers and workstations, and provides an array of products that improve the consistency and reliability of the DRAM assembly process.
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IC Laminate
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IC Leadframe
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Logic
Henkel has been supplying into the Logic / ASIC semiconductor market for decades and has established a reputation for quality, performance and value for money. In fact, Henkel today is the one of the most trusted suppliers to the semiconductor industry.
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Memory
Flash memory forms the data storage of mobile phones, core of MP3 players and most semiconductor memory card formats available today. Demand for these non-volatile memory devices has grown rapidly due to the expansion of mobile handsets, MP3 players and memory cards.
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Optoelectronics
Optoelectronic applications enable all types of data transfer, allowing us to lead lives that are more convenient and information rich. The most effective, efficient and advanced method of data transmission, optoelectronics leverage fiber-optic cables and multiple-optic components to deliver large quantities of information quickly over long distances.
The integrity of the transmission is highly dependent upon the reliability of the fiber-optic connections and the assembly of the accompanying components, such as repeaters, amplifiers and splitters. To ensure robust performance and long-term reliability, advanced capability optoelectronic materials are essential. Henkel’s broad range of LOCTITE®-brand adhesives allows optoelectronic specialists to choose the material that suits specific manufacturing requirements. With superb reliability, fast-cure capability via UV, visible light or thermal techniques, and excellent adhesion on a variety of opto-surfaces, Henkel’s suite of optoelectronic adhesives exceeds today’s market needs.
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Passives Components
As the name implies, passive components do not alter the incoming electrical signal. These packages do, however, play important roles, such as filtering and power supply regulation, and are found on almost all printed circuit board assemblies. Producing these functional devices with materials that enable cost-efficiency and reduced footprints is critical to ensuring competitiveness. Henkel’s full suite of molding compounds, solder and conductive and non-conductive adhesive materials help reduce cost of ownership and address miniaturization challenges for the production of cost-competitive passives.
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Wirebond Packaging
Any integrated circuit that achieves die connectivity through the use of thin wires is known as a wirebond package. BGAs, QFNs, QFPs and SOICs all fall into this category and are found in computers, tablets, smartphones and automobiles. Driving the advancement of wirebond packaging is the need to put more functionality into increasingly smaller geometries, which requires a reduction of the die-to-substrate ratio and the ability to manage very thin dies to reduce package height. Within the automotive sector, where semiconductor use is increasing as vehicles incorporate more electronics, RoHS compliance and high-reliability requirements demand material innovation. Regardless of the wirebond-device application, Henkel’s die attach, solder, mold compound and thermal management materials are enabling packaging specialists to address current and future manufacturing requirements.
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